Intel invests US$300 million in China chip packaging and testing plant

US semiconductor giant Intel said it would expand its chip packaging and testing base in Chengdu, in a show of commitment to the mainland market despite a recent call by a Beijing-backed cybersecurity group to review the company’s products.

In addition to enlarging packaging and testing capacity for server chips, the facility will also establish a “customer solutions centre to improve the efficiency of the local supply chain, increase support for Chinese customers and improve response time”, Intel China said on Monday on its WeChat account.

The Santa Clara, California-based company will inject US$300 million into its local entity, Intel Products (Chengdu), to support the expansion, according to a WeChat post published by the city’s Reform and Development Commission.

Launched in 2003, Intel’s Chengdu plant is responsible for the packaging and testing of more than half of the company’s laptop processors shipped worldwide. Packaging and testing is the final step in semiconductor manufacturing, ensuring the quality and reliability of a product.

Intel’s booth at a supply china expo in Beijing in 2023. Photo: EPA-EFE

The facility plays a critical role in Intel’s global supply chain, while Chengdu provides a “favourable” business environment that paves the way for the company’s “stable growth”, Intel CEO Patrick Gelsinger said during a visit there last year. Chengdu is the capital of China’s southwestern Sichuan province.

Read original article here

Denial of responsibility! Pioneer Newz is an automatic aggregator of the all world’s media. In each content, the hyperlink to the primary source is specified. All trademarks belong to their rightful owners, all materials to their authors. If you are the owner of the content and do not want us to publish your materials, please contact us by email – [email protected]. The content will be deleted within 24 hours.

Leave a Comment